Kick off meeting of Poland Section of Solid-State Circuit Society Chapter
Person responsible: Prof. Pawel Grybos (AGH University of Science and Technology, Krakow)
According to the decision of IEEE Member and Geographic Activities staff and IEEE Technical Activities staff, we are pleased to announced that Poland Section of Solid-State Circuit Society Chapter has been formed. The SSCS Chapter Poland is focused on people from universities, research institutes and industry interested in integrated circuit design. The main tasks of IEEE SSCS Chapter Poland are :
- strengthen the relations between different engineers from university and industry working on solid state circuits,
- create and sustain enthusiasm for custom solid-state circuit design, especially among young engineers,
- increase the quality and innovation factor in our IC designs,
- learn about the latest developments in the field of integrated circuits,
- hold meetings, seminars, short courses for the members and invite distinguished lectures/researchers to Poland ,
- keep a close collaboration with Electron Device Chapter Poland.
We invite everybody who is interested to work within Poland Section of Solid-State Circuit Society Chapter for a kick-off meeting with invited lectures from IEEE Solid-State Circuit Society.
Place: Hotel Orbis Gdynia (room C), Armii Krajowej 22, GDYNIA, Poland
Time and date: 9:15 – 13:00, June 22nd, 2013
Detail plan of the meeting:
| 9:35 |
Meeting opening P. Grybos, R. Kumar, M. Ogorzalek
Challenges and innovation opportunities in semiconductors Phenomenal growth in the use of mobile wireless products is fueling a resurgence of excitement in the semiconductor industry. In spite of increasing investment costs and predictions of doom and gloom a few years back, these are exciting times in the semiconductor innovation pipeline. After providing a brief background and status of the semiconductor industry and its recent drivers, this seminar will offer a discussion of the important challenges and opportunities. The author's recently published book, "Fabless Semiconductor Implementation", McGraw Hill, will serve as a reference text.
3D integration for circuits in radiation detection The exploration of vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This talk examines the opportunities that vertical integration offers by looking at various 3D designs. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. For the first time, Fermilab has organized a 3D MPW run, to which more than 25 different designs have been submitted by the consortium.
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10:55 |
Coffee break |
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11:15 |
A reason for REASON This is a talk about revival of microelectronics in Poland after a total collapse in 1989-1990 - actors, actions, the REASON project, current status and perspectives.
What's new at IEEE SSCS
Chapter matters, activity plans |
