Thermal and Power Delivery Considerations of the 65k Pixel 3-D Integrated Radiation Imaging Module with Through-Silicon Vias

K. Kasiński (AGH Univ. of Science and Techn., Poland)

Single photon counting pixel hybrid detectors are becoming increasingly popular in high energy physics, X-ray detectors for synchrotron applications and medical imaging. They utilize various detector materials and are built using different micro-assembly approaches. Typically readout chips for these detectors have the area of a few cm2 and are designed to be abutted on 3 sides. Large area detectors with no or minimum dead areas are required by many applications. This paper shows thermal and power supply design considerations of the 3-D integrated 2-chip, 2 cm x 2 cm, plug-in radiation imaging modules fabricated using through-silicon vias and redistribution layer deposition micro-assembly technologies.