Comparative Analysis of Compact Thermal Models Generated from Measured Thermal Responses and Detailed Thermal Models
T. Raszkowski, A. Samson, T. Torzewicz, P. Zając, M. Janicki, M. Zubert, A. Napieralski (Lodz Univ. of Techn., Poland)
This paper compares various compact thermal models obtained for a test hybrid circuit using the network identification by deconvolution method. The compact models were generated here both from measured device dynamic thermal responses and from circuit heating curves simulated with a numerical solver. The paper discusses also the influence of different simplifying assumptions on resulting thermal models and their accuracy.
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