MIXDES logo  15th International Conference
Mixed Design of Integrated Circuits and Systems
Poznań, 19-21 June 2008
 IEEE logo 
MIXDES - News  
  The final paper versions (5 days to deadline)
           MIXDES 2008 
  Today (34 days to conference)
General information

Organisers

Deadlines

Venue & accommodation

Travel arrangement

Inquiries

MIXDES Exhibitions

Become an exhibitor

History

MIXVLSI'94
MIXVLSI'95
MIXDES'96
MIXDES'97
MIXDES'98
MIXDES'99
MIXDES 2000
MIXDES 2001
MIXDES 2002
MIXDES 2003
MIXDES 2004
MIXDES 2005
MIXDES 2006
MIXDES 2007

Photo gallery

News
May 15th, 2008:A new account for bank transfers has been provided. The bank transfer payments should be directed to:
Account holder name: Technical University of Lodz, DMCS
Account holder address: Zeromskiego 116, 90-924 Lodz, POLAND
Bank: Bank Handlowy w Warszawie SA, O/Lodz
Address: Piotrkowska 74, 90-950 Lodz, POLAND
Account: 25 1030 1205 0000 0000 5442 5996
SWIFT: CITIPLPX
IBAN: PL 25103012050000000054425996
VAT ID (NIP): PL7270021895
May 12th, 2008:The MIXDES 2008 conference registration is now enabled. The "MIXDES 2008 registration" link is available after you log on.
All the participants willing to pay by bank transfer are kindly asked to delay with the payment a few days since the organising committee is finalising the set up of he conference dedicated account for such payments. It will greatly help us to identify your payment and allow issuing an invoice almost immediately. The information about a new bank account will be sent by e-mail to all the users who has already selected such a payment. The provided account number is still valid, and should be used in case the transfer has to be done immediately.
May 09th, 2008:The MIXDES 2008 Conference registration will be enabled on Monday, May 12th, 2008. We are very sorry for the delay.
Apr 06th, 2008:The technical reviews are ready. The authors are asked to check if any corrections should be done and update their papers if necessary.
Mar 04th, 2008:The paper registration deadline is over. The Organising Committee is assigning now the reviewers to the registered papers. The questions regarding paper registration especially for the invited talks and special sessions should be directed to the conference secretary.
Jul 03rd, 2007:MIXDES 2007 proceedings are available for on-line purchase. See Shop option in top menu.
Jun 27th, 2007:MIXDES 2007 Organising Committee would like to thank all the participants for attending the conference. Some of the photos taken during the Conference are available in Photo gallery. The participants' photos taken during the conference are welcome to be published on the conference website.
The Conference

The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to continue the tradition of inviting you to the most attractive places in Poland and the will take place in Poznań. In a relatively short period of time the conference has become a significant event in the field in the Central Europe encompassing research in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices.

The topics of the MIXDES Conference include:

1. Design of Integrated Circuits and Microsystems
Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.

2. Thermal Issues in Microelectronics
Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.

3. Analysis and Modelling of ICs and Microsystems
Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.

4. Microelectronics Technology and Packaging
New microelectronic technologies. Packaging. Sensors and actuators.

5. Testing and Reliability
Design for testability and manufacturability. Measurement instruments and techniques.

6. Power Electronics
Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.

7. Signal Processing
Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.

8. Embedded Systems
Design, verification and applications.

9. Medical Applications
Medical and biotechnology applications. Thermography in medicine.

Registration

Login

Site registration

Price policy

MIXDES 2008

Topics

Invited papers

Special sessions

Final Call for Papers

Conference timetable

Conference schedule

Paper preparation

Paper format (pdf)

Paper format (doc)

Paper format (rtf)

Paper format (odt)

Paper format (ps)

LaTeX guide

LaTeX example

Publication rules

Presentation rules

Copyright Transfer Form