Conference paper

Modelling of Average Radiation and Convection Heat Transfer Coefficient Value in Electronic Systems

A. Samson, T. Torzewicz, T. Raszkowski, M. Janicki, M. Zubert, A. Napieralski (Lodz Univ. of Techn., Poland)

This paper discusses, based on a practical example, the problem of estimating the average radiation and convection heat transfer coefficient value in thermal models of electronic systems. The proposed empirical formulas are fitted to the results of temperature measurements taken for a power diode attached to a heat sink. The measurements were repeated in natural and forced air cooling conditions. These empirical relations were used subsequently in device simulation with compact thermal models.

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Receipt of papers:

March 15th, 2024

Notification of acceptance:

April 30th, 2024

Registration opening:

May 1st, 2024

Final paper versions:

May 15th, 2024