Conference paper

Observation of Readout Temperature Dependence and Its Variability for the MEMS and ASIC System Specimens and Their PCB Testbenches

M. Jankowski, J. Nazdrowicz, P. Zając, P. Amrozik, M. Szermer, C. Maj, G. Jabłoński (Lodz Univ. of Techn., Poland)

The presented work provides results and discusses implications for introductory comparison of test results of temperature dependence of the integrated semiconductor system designed as a part of a system for imbalance disorder monitoring. Two types of test chips are taken into account, each of them mounted on two PCB versions, provided by different manufacturers. The findings provided by comparative analysis of results obtained for previously performed test sessions are presented and discussed. Their significance paired with the low number of available test setups (chip and PCB variants) point to further analysis steps, which are highlighted and their progress summarized.

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Receipt of papers:

March 15th, 2023

Notification of acceptance:

April 30th, 2023

Registration opening:

May 15th, 2023

Final paper versions:

May 15th, 2023