MIXDES 2026
MIXDES 2026
The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices.
The MIXDES conference papers will be submitted for possible inclusion into IEEE Xplore, subject to IEEE Xplore's scope and quality requirements.
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An issue with on-line payments are now fixed and available in “Conference registration” tab in main screen (PayU link).
Note that only PLN currency is accepted with PayU, so may you need to update your conference registration.
During the second day of the MIXDES 2026 a workshop entitled "Considerations on the Design of Resilient 2.5-3D Heterogeneous, Multilayer Interposer Systems for Chip Lifecycle Management" will take place. Mmore information is available here).