The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to invite you to Gdynia.
The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices.
The MIXDES conference papers are indexed in INSPEC, Web of Science and available in IEEE Xplore.
The topics of the MIXDES Conference include:
Design of Integrated Circuits and Microsystems
Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
Thermal Issues in Microelectronics
Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.
Analysis and Modelling of ICs and Microsystems
Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.
Microelectronics Technology and Packaging
New microelectronic technologies. Packaging. Sensors and actuators.
Testing and Reliability
Design for testability and manufacturability. Measurement instruments and techniques.
Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
Design, verification and applications.
Medical and biotechnology applications. Thermography in medicine.