Conference paper

Nonlinear Thermal Models of Electronic Components

K. Górecki, K. Detka, P. Górecki, P. Ptak (Gdynia Maritime Univ., Poland)

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Download one page abstract

Recent news


9 Aug

Papers available in IEEE Xplore

The papers has been published in IEEE Xplore (DOI: 10.23919/MIXDES58562.2023)

1 Jun

PostMIXDES Publication

All MIXDES 2023 authors will are invited for Energies Special Issue publication (read more).

Partners


Lodz University of Technology Department of Microelectronics and Computer Science Warsaw University of Technology AGH University of Science and Technology
onsite hv solutions Central Europe

MIXDES 2023 Partners


Media patronage Krakow.pl
Silicon Creations
onsite hv solutions Central Europe TELE-FONIKA KABLE

References


Thomson Reuters
INSPEC

IEEE Xplore

Receipt of papers:

March 15th, 2023

Notification of acceptance:

April 30th, 2023

Registration opening:

May 15th, 2023

Final paper versions:

May 15th, 2023