- Design of Integrated Circuits and Microsystems: Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
- Thermal Issues in Microelectronics: Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.
- Analysis and Modelling of ICs and Microsystems: Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.
- Microelectronics Technology and Packaging: New microelectronic technologies. Packaging. Sensors and actuators.
- Testing and Reliability: Design for testability and manufacturability. Measurement instruments and techniques.
- Power Electronics: Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
- Signal Processing: Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
- Embedded Systems: Design, verification and applications.
- Medical Applications: Medical and biotechnology applications. Thermography in medicine.
- Artificial Intelligence in Electronic Systems: AI-driven design. AI-driven signal and data processing. Edge AI.
On-line payments are back
An issue with on-line payments are now fixed and available in “Conference registration” tab in main screen (PayU link).
Note that only PLN currency is accepted with PayU, so may you need to update your conference registration.
