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MIXDES - The MIXDES 2019 information

26th International Conference "Mixed Design of Integrated Circuits and Systems"
Rzeszów, 27.06-29.06 2019

The MIXDES 2019 Conference took place in Rzeszów. The topics of the MIXDES Conference included:

  1. Design of Integrated Circuits and Microsystems
  2. Thermal Issues in Microelectronics
  3. Analysis and Modelling of ICs and Microsystems
  4. Microelectronics Technology and Packaging
  5. Testing and Reliability
  6. Power Electronics
  7. Signal Processing
  8. Embedded Systems
  9. Medical Applications

The total number of 96 papers from 28 countries were accepted for publication including 7 invited papers.

The following invited papers were presented during the conference:

  1. A Review on Quantum Computing: From Qubits to Front-end Electronics and Cryogenic MOSFET Physics,
  2. Centre for Microelectronics and Nanotechnology Rzeszów - Potential and Possibilities,
  3. Advanced MOS Device Technology for Low Power Logic LSI,
  4. Towards Energy-autonomous Integrated Systems Through Ultra-low Voltage Analog IC Design,
  5. Terahertz Technologies and Applications,
  6. What is Killing Moore's Law? Challenges in Advanced FinFET Technology Integration,
  7. Yield and Reliability Challenges at 7nm and Below,

The following special sessions were organised during the conference:

  1. Compact Modeling for Nanoelectronics
    • Analytical Model for Threshold-Voltage Shift in Submicron Staggered Organic Thin-Film Transistors,
    • Low Power Design From Moore to AI for nm Era (Invited Paper),
    • Characterization of the Charge-Trap Dynamics in Organic Thin-Film Transistors,
    • Current vs Substrate Bias Characteristics of MOSFETs as a Tool for Parameter Extraction,
    • The Need of Simulation Methodologies for Active Semiconductor Devices in MEMS (Invited Paper),
    • Closed-Form Modeling Approach of Trap-Assisted Tunneling Current for Use in Compact TFET Models,
    • FOSS Compact Model Prototyping with Verilog-A Equation-Defined Devices (VAEDD),
  2. Thermonuclear Fusion Projects
    • Diagnostics Integration into W7-X CoDaC for OP2,
    • Application of ITER Diagnostics I&C Design Methodology to the ITER Upper Visible/Infrared Wide Angle Viewing System,
    • Magnetics Diagnostics at ITER Using Field Programmable Gate Array Technology,
    • Fast Digital X-ray Detection System Based on Hybrid Pixel Detectors,
    • IFJ PAN Contribution to the ITER Radial Neutron Camera,
    • Impact of Low- and High-Z Ion-induced Damage on the Reflectivity of Molybdenum Mirrors and Sub-surface Microstructure,
    • Instrumentation and Control Development for ITER Diagnostics and Integration with Central CODAC,
    • Overview of Soft X-ray GEM Diagnostic System for Tokamak Impurities Monitoring,
    • Plasma Diagnostics at ITER (Keynote Speech),
  3. Large Scale Research Facilities
    • Status of the Phase Reference Line for the European Spallation Source,
    • Status, Highlights, and Achievements of the ESS Accelerator Project,
    • Institute of Electronic Systems contribution to ESS’s LLRF Control System,
    • Overview of Real-Time Redundancy Development in the Master Oscillator for European XFEL,
    • Upgrade of the Arc Interconnection Verification system for the Large Hadron Collider,
    • Status of the PolFEL Project,
    • IFJ PAN Contribution to the European Spallation Source,
    • FPGA-based Data Processing in the Neutron-Sensitive Beam Loss Monitoring System for the ESS Linac,
    • The Implementation of Thermal-Electrical Analogy to Quench Limit Determination of Superconducting Magnets,
  4. Intelligent Distributed Systems
    • Methods of Device Certification, FIPS 140-2 Standard,
    • Information Security in the Organization: Information Security Management System - ISO Standards,
    • Simulation Environment for Power Transfer States in Renewable Energy Systems,
    • Framework for Intelligent, Distributed Control Systems for Business and Industry,
    • Forecasting Interruptions in Power Supply Using Photovoltaics in Poland - Case Study of Safe Pedestrian Crossing,

26th International Conference "Mixdes Design of Integrated Circuits and Systems" - MIXDES 2019 - zadanie finansowane w ramach umowy 849/P-DUN/2019 ze środków Ministra Nauki i Szkolnictwa Wyższego przeznaczonych na działalność upowszechniająca naukę

Receipt of papers:

March 15th, 2024

Notification of acceptance:

April 30th, 2024

Registration opening:

May 1st, 2024

Final paper versions:

May 15th, 2024