Production of Subsea Cables, Challenges and Special Requirements
L. Resner (TELE-FONIKA Kable S.A., Poland)
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Download one page abstractWorkshop announcement
During the second day of the MIXDES 2026 a workshop entitled "Considerations on the Design of Resilient 2.5-3D Heterogeneous, Multilayer Interposer Systems for Chip Lifecycle Management" will take place. Mmore information is available here).
