Conference paper

Simulation and Modeling of Silicon Semiconductor Devices and Sensors

M. Schwarz, G. Darbandy (THM Univ. of Applied Sciences, Germany), C. Roemer (THM Univ. of Applied Sciences, Germany and Univ. Rovira i Virgili, Spain), N. Dersch, A. Kloes (THM Univ. of Applied Sciences, Germany)

Silicon or general semiconductor device and sensor simulation/modeling is demanded by both, academia and industry. Nowadays, the increase in costs and resources for both domains require strategies to reduce those. This means to investigate new technologies and/or use cases during research and development by simulation/modeling, e.g. process corners by calibrated process simulations. These strategies allow in academia and industry for faster prototyping in all development phases to enhance yield, lower costs, decrease wafer fab process duration, improve technologies, and many more. In this lecture, typical examples of research and industry are presented. Key aspects during simulation/modeling are discussed by several examples.

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Receipt of papers:

March 15th, 2023

Notification of acceptance:

April 30th, 2023

Registration opening:

May 15th, 2023

Final paper versions:

May 15th, 2023