Thermal Coupling Phenomenon in ICs Cooled by Integrated Microchannels

P. Zając, C. Maj, W. Zabierowski, A. Napieralski (Lodz Univ. of Techn., Poland)

Integrated microchannels are a novel cooling method which may help mitigating the problem of increasing power consumption of integrated circuits. However, the properties of such a cooling system are very different from the properties of conventional systems based on forced air convection. For example, thermal coupling work differently in such systems. In this paper, we analyze the impact of this phenomenon on chip temperatures. Additionally, the paper proposes several suggestions for task scheduling algorithms which take into consideration the transient thermal coupling.