Conference paper

Durability and Reliability Enhancement of Selected Electronic Components Achieved by Laser Technologies

R. Pawlak, M. Tomczyk, M. Walczak (Lodz Univ. of Techn., Poland)

The article presents selected laser technologies designed to increase the reliability of some of electrical and electronic components. They include technology of connecting, surface modification or precise shaping. The technique of laser welding as more reliable joining than the traditional technique of thermo-compression and ultra-compression has been described. Our method of welding of thin wires in the power semiconductor devices and technology of welding stranded wires has been introduced. The paper also describes the technology of laser soldering, which causes creation of thinner intermetallic phases owing to a shorter heating times. The laser method of manufacturing of precision fuses is also presented. Selected results of laser method of modification of surface layer of contacts of switching electrodes have been also commented on herein.

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Receipt of papers:

March 15th, 2024

Notification of acceptance:

April 30th, 2024

Registration opening:

May 1st, 2024

Final paper versions:

May 15th, 2024