Photonic Integration for Optical Interconnect and Sensing Applications

S.-L. Lee, Y.-H. Chung (National Taiwan Univ. of Science and Techn., Taiwan), V. Prajzler, V. Jerabek, D. Mares (Tech. Univ. in Prague, Czech Republic)

We will report design examples of PICs for applications in AI optical interconnect and optical sensing. The emphasis is on the development of high-power and tunable light sources based on InP platform and silicon passive and active components for WDM optical transceiver optical engine, photonic switching, and optical phased arrays.