AI-Driven On-Wafer Measurement: Integrated Probing Solutions from DC to 330 GHz, Silicon Photonics, 1/F and High-Power

A. Lord (Chimera Technology, Czech Republic)

The semiconductor test community is under increasing pressure to characterise devices faster, with greater accuracy, and across a widening matrix of measurement disciplines – from RF and millimetre-wave through silicon photonics, high-power compound semiconductors, and low-frequency 1/f noise. This presentation introduces Chimera Technology, a Prague-based supplier of turn-key on-wafer measurement systems serving the EMEA region, and outlines a new generation of integrated probing solutions designed to address these challenges. At the heart of the portfolio is the EOULU F1 series of manual, semi-automatic, and fully automatic probe stations supporting 150 mm, 200 mm, and 300 mm wafers, with the smallest 300 mm footprint in the industry (<1 m × 1 m). The F1 platform delivers fA-level DC accuracy, RF performance up to 500 GHz with mounting for all common frequency extenders (Keysight, VDI, R&S), ±1 °C thermal control from –60 °C to +300 °C, automated RF calibration, and dedicated configurations for silicon photonics (HexaPod and NanoCube alignment), high-power testing to 10 kV / 600 A, and low-noise 1/f, RTS, and RTN measurement. The complementary SKY probe family extends from coaxial to waveguide, single- and dual-signal, with replaceable nickel-alloy tips for low contact resistance and operation from –60 °C to +300 °C. A key focus of the talk is the new EOULU AI suite. futureC AI introduces the industry’s first voice-controlled, hands-free probe station, orchestrating prober, positioners, and instruments through natural-language commands and eliminating the micro-vibration and EMI introduced by physical interaction. futureD AI applies large-language-model technology to wafer-level data analytics, generating yield trends, bin-map anomaly analysis, CPK studies, and 3D wafer maps in seconds rather than hours, with built-in understanding of CP/FT and WAT terminology. The session will close with an introduction to production-grade RF probe cards supplied through a leading manufacturing partner, completing a fully integrated path from early R&D characterisation through to high-volume manufacturing test – all delivered, supported, and serviced from Chimera’s Prague headquarters.