5^th International Conference
Mixed Design of Integrated Circuits and Systems
Łódź, 18-20 June 1998

The MIXDES'98 Conference took place in Łódź, Poland. The topics of the MIXDES Conference included:

1. Design Methodologies, Techniques and Practical Examples
2. Thermal Problems in Semiconductor Devices and ICs
3. Analog and Digital Filters and Signal Processing
4. Advanced Testing Methods and Reliability
5. Neural Networks
6. Sensors, Actuators and Micromachines: Modeling, Simulation and Design
7. Integrated Circuits and Power Devices
8. New Trends in Microelectronics: RF, Low Power, Low Voltage
9. Education of CAD of Modern IC Devices
10. EUROPRACTICE Activities
11. Industrial Applications

The total number of 106 papers from 21 countries were accepted for publication including 7 invited papers.

The following invited papers were presented during the conference:

1. Access to ASICs in Poland: Obstacles and Achievements, W. Kuźmicz (Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, POLAND)
2. CAD for Microdevices and Microsystems: Today's Potentials and Future Visions, G. Wachutka (Technische University Munchen, GERMANY)
3. Design for Manufacturability: A Path from System Level to High Yielding Chips, A. Strójwąs (Carnegie Mellon Univ., USA)
4. From Chip to System Design, L. Peters, T. Roewekamp (German National Research Center for Information Technology GMD-SET, GERMANY), H.-T. Vierhaus (Tech. Univ. Cottbus, GERMANY)
5. GaAs Static Induction Transistors - 10^-14s Electron Transit Time Devices for Communication at Terahertz Frequencies, J. Nishizawa, P. Płotka (Semiconductor Research Institute, Aoba-Ku, Kawauchi, Sendai 980, JAPAN)
6. Semi-Automatic Macro-Modeling of MEMS Devices Using Analog HDLs, B. Romanowicz (Microsystems Technology Laboratories, MIT, USA)
7. Virtual Prototyping of Thermal Management for Advanced Electronics Packaging, A. Przekwas (CFD Research Corporation, USA)