Conference paper

The Need of Simulation Methodologies for Active Semiconductor Devices in MEMS (Invited Paper)

M. Schwarz (Robert Bosch GmbH, Germany)

The demand of a development/design kit for micro electro mechanical systems (MEMS) is even more in focus than ever before. We present a design flow to ensure an integration of active semiconductor devices into micromechanical sensors. The flow considers cross coupling effects and limitations of the electrical active device and mechanical MEMS. An example of a typical MEMS development including mechanical constraints is given. The results are compared with fabricated devices in terms of accuracy and capability of the design flow. Additionally, the capability of capacitance prediction is offered in comparison with measurements. Finally, the realization of a fast analytical compact model for a Monte Carlo simulation methodology is presented which allows for comprehensive parameter studies and sensitivity analysis's to identify the most critical process parameters onto the sensor device performance.

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Receipt of papers:

February 29th, 2020

Notification of acceptance:

April 25th, 2020

Registration opening:

April 30th, 2020

Final paper versions:

May 15th, 2020