Conference paper

Thermal Characterization of Electronic Components Using Single-detector IR Measurement and 3D Heat Transfer Modelling

M. Kopeć, B. Więcek (Lodz Univ. of Techn., Poland)

A novel methodology of thermal impedance measurement by temperature monitoring out of the heat source in a power transistor is presented. A low-cost Infra-Red (IR) head is used to register evolution of temperature after step-function powering. A dedicated power generator has been developed to synchronize temperature recording with power dissipation in a device. Estimation of temperature in the heat source is performed by 3D FEM modelling of multilayer transistor structure. It allows fitting the measurement and simulation results to achieve the classically-defined thermal impedance in the heat source.

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Receipt of papers:

March 13th, 2020

Notification of acceptance:

May 18th, 2020

Registration opening:

May 20th, 2020

Final paper versions:

June 5th, 2020