TSRI Platform for Advanced Packaging and Silicon Photonics - Ecosystem for Industry–Academia–Research Collaboration
C.-N. Liu (Taiwan Semiconductor Research Inst., Taiwan)
-
Recent news
14May
On-line payments are back
An issue with on-line payments are now fixed and available in “Conference registration” tab in main screen (PayU link).
Note that only PLN currency is accepted with PayU, so may you need to update your conference registration.
10May
Workshop announcement
During the second day of the MIXDES 2026 a workshop entitled "Considerations on the Design of Resilient 2.5-3D Heterogeneous, Multilayer Interposer Systems for Chip Lifecycle Management"
will take place. Mmore information is available here).